Dense Pac Microsystems Ins

Dense-Pac Microsystems Inc. said Tuesday it received a $668,000 purchase order for its three-dimensional stackable memory product from airplane maker GEC-Marconi Avionics Inc., a unit of General Electric PLC. The company said the product will be used for new high-density avionics instrumentation and an upgrade for an undisclosed aircraft instrument. Dense-Pac, which designs and makes computer chip stacking technologies, had about $10.6 million in sales for the nine months ended Nov. 30.

Dense-Pac Microsystems Inc. said Tuesday it received a $668,000 purchase order for its three-dimensional stackable memory product from airplane maker GEC-Marconi Avionics Inc., a unit of General Electric PLC. The company said the product will be used for new high-density avionics instrumentation and an upgrade for an undisclosed aircraft instrument. Dense-Pac, which designs and makes computer chip stacking technologies, had about $10.6 million in sales for the nine months ended Nov. 30.